Physical and Mechanical Properties of High-Density Fiberboard Bonded with Bio-Based Adhesives

The high demand for wood-based composites generates a greater use of wood adhesives. current industrial challenge is to develop modified synthetic adhesives remove harmful formaldehyde, and test natural scope the research included manufacturing high-density fiberboards (HDF) using binders such as polylactic acid (PLA), polycaprolactone (PCL), thermoplastic starch (TPS) with different resination (12%, 15%, 20%). HDF biopolymers was compared reference HDF, manufactured following example technology, commonly used urea-formaldehyde (UF) resin. Different mechanical physical properties were determined, namely modulus rupture (MOR), elasticity (MOE), internal bonding strength (IB), thickness swelling (TS), water absorption (WA), surface (SWA), contact angle, well density profile; scanning electron microscope (SEM) analysis also performed. results showed that increasing binder content significantly improved panels in case (MOR from 31.35 N mm?2 40.10 mm?2, IB 0.24 0.39 dry starch), reduces these PLA PCL. wet method addition panels; however, it negatively influenced reaction (WA 90.3% 105.9% after 24 h soaking). Due dynamically evaporating solvents PCL binding mixtures, development fibers’ (blending) techniques should be performed, avoid uneven spreading over resinated material.